 
                                        C2F Series
                            
                                Features
                            
                            
                        - Ceramic substrate, printed element construction
- RoHS6 Compliant
- Pb-Free
- Halogen-Free
- T&R, Auto-Insertable
                            
                                Specifications
                            
                            
                - Fuse Type: Chip Fuse
- Current (A): 0.5 ~ 8
- Voltage (VDC): 63
- Voltage (VAC): 32
- Mounting Type: Surface Mount
- Response Time: Fast Blow
- Case Size: 603
- AEC-Q200 Compliant: Yes
- RoHS Compliant: Yes
                                        
                                        
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